VisionSOM-V2L: Difference between revisions
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{{Product|category1=SOM|category2=|image=VisionSOM- | {{Product|category1=SOM|category2=|image=VisionSOM-x2L.png | ||
|cpu=Renesas RZ/V2L (R9A07G054L27GBG) - dual-core ARM Cortex-A55 (at speed up to 1.2GHz), ARM Cortex-M33 core (at speed up to 200MHz) and DRP-AI (AI+ML) coprocessor | |cpu=Renesas RZ/V2L (R9A07G054L27GBG) - dual-core ARM Cortex-A55 (at speed up to 1.2GHz), ARM Cortex-M33 core (at speed up to 200MHz) and DRP-AI (AI+ML) coprocessor | ||
|ram=1GB DDR4 | |ram=1GB DDR4 | ||
| Line 9: | Line 9: | ||
|i2c=up to 4 channels | |i2c=up to 4 channels | ||
|spi=up to 3 channels | |spi=up to 3 channels | ||
|net= | |net=2.4 GHz WiFi, Bluetooth BLE<br>2 x Ethernet 10/100/1000 (MAC only) | ||
|bluetooth=Bluetooth: BLE v5.1 | |bluetooth=Bluetooth: BLE v5.1 | ||
|temp= -25 to +70°C (with WiFi/BLE module),<br>-40 to +85°C | |temp= -25 to +70°C (with WiFi/BLE module),<br>-40 to +85°C | ||
Latest revision as of 09:49, 4 September 2023
| VisionSOM-V2L |
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VisionSOM-V2L is comprised of a small and energy efficient processor module with CPU interfaces accessibility, Machine-Learning + Artificial Intelligence DRP-AI coprocessor and standard I/O functionality. It is an ideal solution for modern IoT embedded projects and intelligent edge devices. VisionSOM-V2L can trim 8-12 months from design cycle and can be easy adapted to existing projects or can be used together with a dedicated carrier board. Customers who are looking for a complete solution can use a set comprised of System on Module (SoM) and Carrier Board (CB). VisionSOM-V2L requires a matching customer’s board or a carrier board to establish a complete system. Carrier Board together with VisionSOM-V2L is a ready to use computer on board and is giving enormous flexibility in building projects. |
Documentation
How to
Embedded Linux Developer Guide
Yocto
Yocto Developer Guide
| Specifications |
| CPU | Renesas RZ/V2L (R9A07G054L27GBG) - dual-core ARM Cortex-A55 (at speed up to 1.2GHz), ARM Cortex-M33 core (at speed up to 200MHz) and DRP-AI (AI+ML) coprocessor |
| Memory | 1GB DDR4 |
| GPU | 3D ARM Mali-G31 |
| Display | MIPI-DSI |
| Camera | MIPI-CSI – 4 lane interface |
| Storage | up to 32GB eMMC |
| Network | 2.4 GHz WiFi, Bluetooth BLE 2 x Ethernet 10/100/1000 (MAC only) |
| I2C | up to 4 channels |
| SPI | up to 3 channels |
| CAN | up to 2 channels CAN-FD |
| UART | up to 5 channels |
| USB | 2 x USB 2.0 |
| Audio | up to 4xSAI 1xSRC |
| Temperature Range | -25 to +70°C (with WiFi/BLE module), -40 to +85°C |
| Dimensions | 67mm x 32mm x 4.1mm SODIMM200 module |
