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Difference between revisions of "VisionSOM-6UL"

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'''Debian''' - coming soon
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'''Debian Developer Guide'''
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* [[Debian Stretch 9.2 (4.1.15) for VisionSOM-6ULL|Debian Stretch 9.2 (4.1.15) for VisionSOM-6ULL]]
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}}{{DocBox|boxwidth=21|system=Buildroot
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'''Buildroot Developer Guide'''
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*[[VisionSOM-6ULL Buildroot Developer Guide|Developer Guide]]
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}}{{DocBox|boxwidth=21|system=Projects
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|content=
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'''Projects'''
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*[[Hardware-accelerated video playback on the VisionSOM-6ULL (GStreamer with support for PxP engine)|Hardware-accelerated video playback on the VisionSOM-6ULL (GStreamer with support for PxP engine)]]
 
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Revision as of 16:36, 15 March 2018

VisionSOM-6UL
VisionSOM-6UL VisionSOM-6UL is comprised of a small processor module with CPU bus accessibility and standard I/O functionality and is an ideal solution for embedded projects.
VisionSOM-6UL can often trim 8-12 months from design cycle and can be easy adapted to existing projects or can be used together with a dedicated carrier board. Customers who are looking for a complete solution can use a set comprised of System on Module (SoM) and Carrier Board (CB).
VisionSOM-6UL requires a matching customer’s board or a carrier board to establish a complete system. Carrier Board together with VisionSOM-UL is ready to use computer on board and is giving enormous flexibility in building projects.
Documentation
Yocto
Yocto - coming soon.
Debian
Buildroot
Buildroot Developer Guide
Specifications
CPUNXP i.MX6UL Cortex-A7 32-bit processor (CPU clock up to 696MHz)
Memoryup to 512MB DDR3L
GPUNXP PXP v2.0 2D
graphics accelerator for LCD-TFT
Display24-bit RGB parallel interface
Cameraup to 24-bit CSI interface
StorageuSD card
or up to 32GB eMMC
or up to 512MB NAND Flash
NetworkWi-Fi 802.11b/g/n, Bluetooth BLE
2 x Ethernet: 10/100 (MAC only)
RTCbuilt-in with external battery
I2Cup to 4 channels
SPIup to 4 channels
CANup to 2 FlexCAN
UARTup to 8 channels
USB2 x USB2.0 OTG Host/Device
Audio3 x I2S
S/PDIF Tx/Rx
SecurityCrypto Engine (AES/TDES/SHA)
Secure Boot
TRNG
Temperature Range-30 to +70°C (with WiFi/BLE module),
-40 to +85°C
Dimensions67mm x 32mm x 4mm
SODIMM200 module
NXP Partner ST Partner Renesas Partner