SpaceSOM-8Mplus: Difference between revisions
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* [[Using USB OTG dual role on SpaceSOM-8Mplus|Using USB OTG dual role on SpaceSOM-8Mplus]] | * [[Using USB OTG dual role on SpaceSOM-8Mplus|Using USB OTG dual role on SpaceSOM-8Mplus]] | ||
* [[Reducing CPU frequency in iMX8M processors|Reducing CPU frequency in iMX8M processors]] | |||
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Latest revision as of 10:09, 16 October 2024
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SpaceSOM-8Mplus is comprised of a small and energy efficient processor module with CPU interfaces accessibility, Machine-Learning + Artificial Intelligence NPU coprocessor and standard I/O functionality. It is an ideal solution for modern IoT embedded projects and intelligent edge devices. SpaceSOM-8Mplus can trim 8-12 months from design cycle and can be easy adapted to existing projects or can be used together with a dedicated carrier board. Customers who are looking for a complete solution can use a set comprised of System on Module (SoM) and Carrier Board (CB). SpaceSOM-8Mplus requires a matching customer’s board or a carrier board to establish a complete system. Carrier Board together with SpaceSOM-8Mplus is a ready to use computer on board and is giving enormous flexibility in building projects. |
Documentation
How to
Yocto
Yocto Developer Guide
- iMX Yocto Scarthgap meta-layer for SpaceSOM-8MM by SoMLabs
- iMX Yocto Mickledore meta-layer for SpaceSOM-8MM by SoMLabs
- iMX Yocto Kirkstone meta-layer for SpaceSOM-8MM by SoMLabs
- iMX Yocto Honister meta-layer for SpaceSOM-8Mplus by SoMLabs
- iMX Yocto Hardknott meta-layer for SpaceSOM-8Mplus by SoMLabs
Ubuntu
Ubuntu Developer Guide
Projects
| Specifications |
| CPU | i.MX8M Plus Quad - Quad ARM Cortex-A53 cores (at speed up to 1.8GHz), ARM Cortex-M7 core (at speed up to 800MHz) and NPU (AI+ML) coprocessor |
| Memory | up to 4GB LPDDR4 |
| GPU | 3D Vivante GC7000UL/2D Vivante GC520 |
| Display | HDMI, MIPI-DSI, LVDS |
| Camera | MIPI-CSI – 4 lane interface |
| Storage | up to 32GB eMMC |
| Network | dual-band 2.4/5GHz (802.11a/b/g/n/ac), Bluetooth BLE Ethernet 10/100/1000 (MAC only) |
| PCI | Express 3.0 |
| I2C | up to 4 channels |
| SPI | up to 3 channels |
| CAN | up to 2 channels CAN-FD |
| UART | up to 4 channels |
| USB | 2 x USB 2.0/3.0 |
| Audio | up to 5xSAI (I2S, AC97, TDM, codec/DSP, DSD, EARC) |
| Security | eFuses AHB ARM Trust Zone RSA Elliptic Curve Crypto |
| Temperature Range | 0 to 70°C, -25 to +70°C (with WiFi/BLE module), -40 to +85°C |
| Dimensions | 69.6mm x 35mm x 3.7mm SODIMM260 module |
