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Difference between revisions of "StarSOM-6ULL"

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'''Yocto Developer Guide'''
 
'''Yocto Developer Guide'''
 +
* [[VisionSOM_imx-meta-somlabs-scarthgap | iMX Yocto Scarthgap meta-layer for VisionSOM-6ULL by SoMLabs]]
 
* [[VisionSOM_imx-meta-somlabs-mickledore | iMX Yocto Mickledore meta-layer for VisionSOM-6ULL by SoMLabs]]
 
* [[VisionSOM_imx-meta-somlabs-mickledore | iMX Yocto Mickledore meta-layer for VisionSOM-6ULL by SoMLabs]]
 
* [[VisionSOM_imx-meta-somlabs-kirkstone | iMX Yocto Kirkstone meta-layer for VisionSOM-6ULL by SoMLabs]]
 
* [[VisionSOM_imx-meta-somlabs-kirkstone | iMX Yocto Kirkstone meta-layer for VisionSOM-6ULL by SoMLabs]]

Latest revision as of 14:51, 25 July 2024

StarSOM-6ULL
StarSOM-6ULL StarSOM-6ULL is comprised of a small processor module with CPU bus accessibility and standard I/O functionality and is an ideal solution for embedded projects.
StarSOM-6ULL can often trim 8-12 months from design cycle and can be easy adapted to existing projects or can be used together with a dedicated carrier board. Customers who are looking for a complete solution can use a set comprised of System on Module (SoM) and Carrier Board (CB).
StarSOM-6ULL requires a matching customer’s board or a carrier board to establish a complete system. Carrier Board together with StarSOM-6ULL is ready to use computer on board and is giving enormous flexibility in building projects.
Specifications
CPUNXP i.MX6ULL Cortex-A7 32-bit processor (CPU clock up to 900MHz)
Memoryup to 1GB DDR3L
GPUNXP PXP v2.0 2D
graphics accelerator for LCD-TFT
Display24-bit RGB parallel interface
Cameraup to 24-bit CSI interface
Storageup to 32GB eMMC
NetworkWi-Fi 802.11b/g/n, Bluetooth BLE
2 x Ethernet: 10/100 (single PHY10/100 on-board)
RTCbuilt-in with external battery
I2Cup to 4 channels
SPIup to 4 channels
CANup to 2 FlexCAN
UARTup to 8 channels
USB2 x USB2.0 OTG Host/Device
Audio3 x I2S/SAI,
S/PDIF Tx/Rx,
ESAI,
Medium Quality audio System
SecurityAES-128,
ARM TrustZone,
RNG
Temperature Range0 to 70°C,
-30 to +70°C (with WiFi/BLE module),
-40 to +85°C
Dimensions40mm x 44mm x 4mm
module equipped with
2x100 pin board-to-board connectors
NXP Partner ST Partner Renesas Partner